Cyber-Physical Assembly Systems: Real-Time Adaptation Through Edge  Intelligence and Manufacturing Orchestration

Ramachandra Handaragal

Cyber-Physical Assembly Systems: Real-Time Adaptation Through Edge Intelligence and Manufacturing Orchestration

Authors

Ramachandra Handaragal

Keywords:

Connected Manufacturing, Assembly Line Design, IoT Integration, Oracle SCM, Adaptive Production, Industry 4.0

Abstract

Modern manufacturing faces unprecedented challenges in achieving flexible, responsiveassembly operations capable of handling volatile demand, product variety, and qualityrequirements. This paper presents a comprehensive framework for designing connectedassembly lines that integrate Internet of Things (IoT) technologies with Oracle Supply ChainManagement (SCM) capabilities

References

World Economic Forum, "The Future of Manufacturing: Driving Capabilities, Enabling Investments," Manufacturing Industry Report, 2023.

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Published

2023-10-14

How to Cite

Ramachandra Handaragal. (2023). Cyber-Physical Assembly Systems: Real-Time Adaptation Through Edge Intelligence and Manufacturing Orchestration. Journal of Computational Analysis and Applications (JoCAAA), 31(4), 2431–2454. Retrieved from https://eudoxuspress.com/index.php/pub/article/view/4673